Guidelines for Packaging of Microfluidics: Electrical Interconnections

Members of the MFManufacturing project published in Oct. 2017 guidelines to address the packaging of microfluidics, especially for hybrid systems where sensors or actuators are integrated in the product.

For microfluidic products, packaging has to provide also for fluidic interconnections and in some cases also optical interconnections.

Other requirements are:

  • leak free microfluidic channels etc.,
  • well defined microfluidic path (no dead volumes, sufficient lengths to ensure laminar flows etc.),
  • no incompatible materials in the microfluidic path.

These additional requirements makes a microfluidic package much more complex than an electronic package.

Document available to download (PDF format):